Siemens Digital Industrial Software announced that it will cooperate with ASE Group (ASE), the world's leading semiconductor packaging, testing and manufacturing service provider, to develop a 3Dblox-based workflow for the ASE VIPack platform with Siemens' Innovator3D IC solution that has been fully certified by 3Dblox.

Siemens stated that the two parties have currently cooperated to complete the 3Dblox workflow verification of three VIPack technologies, including chip packaging on fan-out substrates (FOCoS), chip bridge on fan-out substrates (FOCoS-Bridge), and 2.5D/3D IC technology based on through-silicon vias (TSV).

The ASE VIPack platform consists of six core packaging technology pillars and is supported by a fully integrated collaborative design ecosystem. As ASE's advanced packaging platform, VIPack aims to achieve vertically integrated packaging solutions and represents ASE's next-generation 3D heterogeneous integration architecture, which can break through the limitations of existing design rules and achieve ultra-high density and excellent performance. The platform uses advanced redistribution layer (RDL) process, embedded integration and 2.5D/3D technology to help customers achieve unprecedented technological innovation when integrating multiple chips in a single package.

Dr. Hong Zhibin, Vice President of ASE R&D Center, said that Siemens’ Innovator3D IC provides ASE with an efficient design integration and exploration platform that can read and write 3Dblox data. This cooperation allows ASE to optimize work efficiency by formulating 3Dblox standard definitions for some leading VIPack technologies, providing customers with EDA tool flexibility, helping them quickly overcome packaging design problems and accelerate product launch time.

3Dblox and Innovator3D IC support hierarchical component planning driven by System Technology Co-Optimization (STCO). This planning capability is critical for achieving chiplet-based heterogeneous integration using advanced packaging technologies such as the ASE VIPack platform.

AJ Incorvaia, senior vice president of Siemens Digital Industrial Software Electronic Circuit Board Systems, said that Siemens and ASE have carried out a series of fruitful cooperation, and both parties are committed to applying 3Dblox to the field of semiconductor packaging design and verification to simplify the design process and achieve open interoperability. As 3Dblox technology continues to expand, we will create greater value and provide stronger technical capabilities for our mutual customers.